view【PRODUCT - Outline】 |
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Lead-free series of wash-free soldering paste is a kind of environmental protectionand no clean soldering flux paste designed for SMT production process. It is made from special soldering flux paste and lead-free solder prower with wxtremelylow oxide content,and has outstanding continuous printing peformance. Besides,this series of products has a low ionic active agent system of high reliability,which makes the residue extremely little fitter reflow soldering,and has a veryhigh insulation resistance and veryreliability even no clean. In addition, lad-freesoldering pastes of different alloye compositions,different tin power particles and different alloy contents are provided to meet customer s process requirements todifferent products.
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view【Product - Features】 |
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High print speed:0.120mm/sec
Over 6 hours of module print time
Excellent wet ability
A longer time of viscosity maintenance
Not easy to collapse,
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view【Product - Technology Planning】 |
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Solder Paste series
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Product
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JX-LF2001
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JX-LF300T-3B
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JX-LF2003-5
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JX-GW9038/3B
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JX-LED-M
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欧盟标准
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Pass(合格)
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Pass(合格)
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Pass(合格)
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有铅
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有铅
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Code
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42Sn-58Bi
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99Sn-0.3Ag-0.7Cu
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82.5Sn-0.5Cu-17Bi
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63Sn-37Pb
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55Sn-45Pb
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Melting point
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138
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217-227
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180-209
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183
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183-203
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Soldering Flux Content
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11.8±0.3
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11.7±0.3
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9.8±0.3
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9.7±0.3
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9.6±0.3
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Particle Size
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25-45
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25-45
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25-45
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25-45
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25-63
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Halogen Content
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L1
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L1
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L1
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L0
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L0
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(Pa.s)Visccosity
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170±30
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190±30
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170±30
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190±30
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190±30
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(gf)Adhesion Force
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130
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130
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130
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133
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131
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Corrosion
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PASS
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PASS
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PASS
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PASS
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PASS
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Insulation Resitance
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108Ω
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108Ω
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108Ω
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108Ω
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108Ω
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Electro migration
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PASS
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PASS
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PASS
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PASS
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PASS
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ROHS
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PASS
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PASS
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PASS
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━
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━
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view【Product - process parameters】 |
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常见焊接缺陷及原因参照表:
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1
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2
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3
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4
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5
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6
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7
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8
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9
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10
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缺陷现象╲引致原因
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※
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※
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漏锡
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※
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※
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※
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※
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※
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多锡
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※
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锡洞
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※
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※
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锡孔
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※
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※
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※
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※
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※
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※
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※
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拉尖
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※
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粗锡
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※
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※
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※
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※
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桥锡
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※
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※
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※
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※
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※
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锡球
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※
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※
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※
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短路
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