Features of lead-free solder wire
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Series
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Model
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Representative Composition
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Fusion Temperature
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Sn-Cu
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Sn-0.7Cu
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227
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Low melting point,low Using temperature,strong antioxidant property and thermal fatugue resistance.The surface of solder joints is bright,solderwith glazed surface,mainly used for manual soldering and wave soldering
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Sn-1.5Cu
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227
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Sn-3.0Cu
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227-300
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Low melting point,good fluidity,bright solder joints,and low cost,mainly used for manual soldering.
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Sn-Cu-Ni-Ce
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Sn-0.7Cu-0.1Ni-0.1Ce
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227
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Low melting point,good fluidity,bright solder joints,and low cost,mainly used for wave soldering.
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Sn-Ag-Cu
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Sn-3.8Ag-0.7Cu
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217-219
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Low melting point,good fluidity and invasive ability,good thermal fatigue resistance and highcost,mainly used for manual soldering and wave soldering.
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Sn-3.0Ag-0.5Cu
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217-220
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Sn-0.3Ag-0.7Cu
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217-227
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Sn-Zn
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Sn-9Zn
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198-200
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Melting point is close to Sn-Pb eutectic solder,but the wet ability and antioxidative effects are poor.
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Sn-Sb
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Sn-5Sb
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240-243
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High strength,good anti-oxidation property,and can inhibit effetively the gorwth of interface metal compounds and im poreve the solderability of solder joints,oftenused for manual soldering
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Sn-In
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Sn-52In
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118
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Sn-Bi
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Sn-58Bi
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138
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The products have relatively good performance,but the creep property and tensile strength are poore,applicable to low temperature soldering of special process.
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Sn-Zn-Bi
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Sn-8Zn-3Bi
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190-197
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Sn
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Sn-99.99
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232
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Mainly used for handicraft and electroplating process
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