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Current location: Home > PRODUCTS > Reflow soldering
New Products
Free solder wire
Without Tin
Solder wire
There Tin
Paste
Disposable flux
Cleaner
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【PRODUCT - Outline】
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【Product - Features】
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【Product - Technology Planning】
Technical Specifications
Ltem
Specifications
Reference Standard
Solder joint
Bright
\
Appearance
Pale yellow Clear Liquid
GB/9491-2002
Solids Content,wt/wt%
2-3
GB/9491-2002
SPECIFIC GRAVITY(20℃)
0.800±0.005
GB/9491-2002
HALIDE CONTENT,wt/wt%
not detected
GB/9491-2002
ACID VALUE(mgKOH/g)
16-18
GB/9491-2002
SPREAD FACTOR
≥75
GB/9491-2002
Copper plate corrosion
No evidence of corrosion
GB/9491-2002
SIR(40°C,90% RH)
≥10??Ω
GB/9491-2002
conductivity of aqueous extract
≥10
?
GB/9491-2002
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【Product - process parameters】
Technological Parameters
Bottom side Preheat Temperature
90-100°C
Conveyor Angle
4-6°
Conveyor Speed
1.2-1.6m/min
Contact Time in the Solder
2.0-3.0 sec
Solder Pot Temperatyre (Sn63/Pb37)
245-255°C
Application method
Dip
Recommended Thinner
JX-600
Recommended cleaner
JX-808
Shelf Life
12 months
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JX-912AV-CUT基板分板机
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