view【PRODUCT - Outline】 |
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High-performance solder resists melting speed, good mobility, tin speed.
Low welding spatter solder resist.
Solder resist distribution, good continuity.
Very little smoke and the smell of gas.
Inhibit the growth of solder joint cracking, corrosion and copper alloy layer interface.
Low residual, non-corrosive, high insulation resistance, no-clean solder wire.
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view【Product - Features】 |
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Anaerobic continuous casting, high purity alloys.
Inline resin distribution, good continuity.
There are good wettability and scalability.
Good weldability, welding speed, solid solder joint reliability.
Welding spatter, low smoke, non-toxic health of volatile gases.
Full bright spot, excellent electrical properties, very little residue after soldering.
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view【Product - Technology Planning】 |
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Common specifications of solder wire
Series
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Fusion Temperature
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Fusion Temperature
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Fusion Temperature
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use
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63Sn/37pb
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183
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240-254
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8.40
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Low meltiing piint fluidity.mainly used for the soldering of precision instruments,electrical and electonice,wave soldering and circuit board elements and aviation.
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60Sn/40pb
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183-191
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250-260
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8.50
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55Sn/45pb
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183-200
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260-280
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8.68
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50Sn/50pb
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183-212
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280-300
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8.87
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Mainly used for the soldering of household elec-trical appliances,auto electric parts and other general elecronic product
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45Sn/55pb
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183-227
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280-320
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9.07
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40Sn/60pb
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193-238
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290-330
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9.28
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High melting piint,mainly used for soldering mechanical machine,lamp holder,auto water tank and the welding of cable connectors
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view【Product - process parameters】 |
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Category
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Code
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Standard Soldering Flux content
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Main Features
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Rosin Base
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JX-T
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2.2%
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meet the reqirements of hanloge-free.It is most widely used
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JX-H
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2.2%
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nick-plated elements and soldering of lamp holder
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JX-P
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2.2%
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Soldering at zinc spray end of capacitor
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JX-HF
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2.2%
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Almost completely halogen-free
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Water Solubility
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JX-WS
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2.2%
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The residue can be ckeaned with water
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