view【PRODUCT - Outline】 |
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JX-911 is a low-solid flux for dip soldering applications,provides excellent solder performance and reliability for the Tin-Lead alloy,can meet the requirement of no-cleaning process. Additionally,low-tacky flux reside is left on the PCB side after soldering,no visible white residue
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view【Product - Features】 |
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No visible white residue, Non-corrosion residue, Eliminates Cleaning
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view【Product - Technology Planning】 |
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Technical Specifications
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Ltem
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Specifications
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Reference Standard
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Solder joint
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Bright
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\
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Appearance
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Light yellow transparent liquid
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GB/9491-2002
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Solids Content,wt/wt%
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2-3
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GB/9491-2002
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SPECIFIC GRAVITY(20℃)
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0.800±0.005
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GB/9491-2002
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HALIDE CONTENT,wt/wt%
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not detected
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GB/9491-2002
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ACID VALUE(mgKOH/g)
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16-18
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GB/9491-2002
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SPREAD FACTOR
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≥75
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GB/9491-2002
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Copper plate corrosion
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No evidence of corrosion
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GB/9491-2002
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SIR(40°C,90% RH)
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≥1011Ω
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GB/9491-2002
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conductivity of aqueous extract
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≥104
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GB/9491-2002
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view【Product - process parameters】 |
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Technological Parameters
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Bottom side Preheat Temperature
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90-100°C
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Conveyor Angle
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4-6°
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Conveyor Speed
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1.2-1.6m/min
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Contact Time in the Solder
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2.0-3.0 sec
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Solder Pot Temperatyre (Sn63/Pb37)
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245-255°C
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Application method
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Dip
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Recommended Thinner
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JX-600
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Recommended cleaner
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JX-808
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Shelf Life
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12 months
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