view【PRODUCT - Outline】 |
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JX-788 is a halide-free,rosin/resin free ,low solids,no-clean liquid flux,specifically developed for foam,spray,and wave applications The unique activator system offers good thermal stablity and excellent solderability
reduced defects on surface mount,through-hole and mixed-technology assemblies. And remains practically no residue fter wave soldering
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view【Product - Features】 |
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Excellent Surface Wetting,Eliminates Cleaning,Excellent Solderability
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view【Product - Technology Planning】 |
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Technical Specifications
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Ltem
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Specifications
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Reference Standard
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Solder joint
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Bright
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\
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Appearance
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Coloress Clear Liquid
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GB/9491-2002
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Solids Content,wt/wt%
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2-3
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GB/9491-2002
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SPECIFIC GRAVITY(20℃)
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0.800±0.005
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GB/9491-2002
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HALIDE CONTENT,wt/wt%
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not detected
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GB/9491-2002
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ACID VALUE(mgKOH/g)
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18-20
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GB/9491-2002
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SPREAD FACTOR
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≥80
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GB/9491-2002
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Copper plate corrosion
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No evidence of corrosion
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GB/9491-2002
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SIR(40°C,90% RH)
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≥1011Ω
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GB/9491-2002
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conductivity of aqueous extract
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≥104
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GB/9491-2002
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view【Product - process parameters】 |
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Technological Parameters
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Bottom side Preheat Temperature
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90-100°C
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Conveyor Angle
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5-7°
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Conveyor Speed
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1.2-1.7m/min
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Contact Time in the Solder
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2.0-3.0 sec
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Solder Pot Temperatyre (Sn63/Pb37)
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245-260°C
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Application method
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Spray or Foam
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Recommended Thinner
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JX-600
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Recommended cleaner
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JX-808
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Shelf Life
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12 months
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